Sr Advanced IC Package Design Engineer - Remote - Honeywell : Job Details

Pay: $118,000.00 - $178,000.00 / year

Location: Plymouth, Minnesota

Employment type: Other

Req#: 125365 Innovate to solve the world's most important challenges. The future is what you make it.

When you join Honeywell, you become a member of our global team of thinkers, innovators, dreamers, and doers who make the things that make the future.

That means changing the way we fly, fueling jets in an eco-friendly way, keeping buildings smart and safe, and even making it possible to breathe on Mars.

Working at Honeywell isn't just about developing cool things. That's why all of our employees enjoy access to dynamic career opportunities across different fields and industries.

Are you ready to help us make the future?

Join a team that designs, verifies, integrates, and tests complex products within Honeywell Aerospace. You will develop new products and processes in support of the organization's business strategies. You will be responsible for developing new SoC modules, interacting with key outside development partners, creating test benches, preparing documentation, and optimizing manufacturing. You will work closely with world-class hardware and software engineers during planning, requirements and architecture, design, test, and integration phases of IC Product Development.

• Work with cross-functional teams to develop advanced IC packaging solutions, including design, material selections, qualification, and release to manufacturing system.
• Prepare and/or update specifications for piece parts of integrated circuit assemblies.
• Perform failure analysis on defective components or products.
• Select equipment and material to meet quality, reliability, cost, yield, and manufacturability requirements.
• Manage relationships with key packaging partners and material suppliers.
• Prepare documentation.
• Create project plans and execute with adherence to schedule and budget.

• Bachelor's Degree in Electrical Engineering.
• 5 years of experience in package design.
• Experience with package-design CAD modeling tools.
• US Citizenship is required.
• Previously held USG Secret clearance, or no known barriers to achieve a USG Secret security clearance is required.

• Advanced degree in Electrical Engineering.
• Experience with ceramic packaging design and qualification.
• Experience with multi-chip module design and qualification.
• Knowledge of assembly process options and flows and corresponding package types including 2.5D and 3D heterogeneous integration technologies.
• Knowledge of chip-package interactions and chip-board interactions including material science, electrical performance characteristics, and heat transfer physics.
• Knowledge of advanced electronic test and troubleshooting techniques at the component level.
• Physical design experience including custom circuit layout.
• Laboratory experience (hardware configuration, measurement systems).
• Radiation effects analysis knowledge/experience.
• Advanced node and SOI technology design experience.
• Good communication skills (verbal and written).
• Strong computer and web navigation skills (Word, Excel, PowerPoint, web browsers).
• Self-starter, motivated, takes initiative, and able to lead a small team.
• Strong technical problem-solving skills.

• JOB ID: HRD198897
• Category: Engineering
• Location: 12001 State Highway 55, Plymouth, Minnesota, 55441, United States
• Exempt
• Must be a US Citizen due to contractual requirements.

Honeywell is an equal opportunity employer. Qualified applicants will be considered without regard to age, race, creed, color, national origin, ancestry, marital status, affectional or sexual orientation, gender identity or expression, disability, nationality, sex, religion, or veteran status.

Honeywell International Inc. is an American publicly traded, multinational conglomerate corporation headquartered in Charlotte, North Carolina.