Overview
Seeking engineers for an exciting opportunity with the MMIC Design Center organization under CAES by Honeywell Defense Systems, located in Richardson, TX, or Forsyth, MO. The center comprises a team of 20+ MMIC and Packaging Designers creating advanced RF solutions for various customers. The team also includes PMO, test, and support engineering to convert designs into products, along with systems expertise for customer architectures and trade studies. Join us and apply today!
Responsibilities
Essential functions and duties include:
- Assisting customers with trade-offs to define MMIC specifications
- Leading design activities for GaN and GaAs MMIC products
- Leading design in advanced packaging from multi-chip modules to flip-chip interfacing
- Interfacing with customers on performance and compliance reports
- Developing new technology and contributing to roadmaps
- Using RF circuit simulation tools such as AWR, ADS, Sonnet, or HFSS
- Leading IR&D and product roadmap projects
- Performing RF/Microwave measurements in the lab
- Supporting proposal efforts and mentoring junior engineers
Qualifications
Minimum:
- Bachelor's in Electrical or related Engineering
- 11+ years in advanced semiconductor technologies like GaN or GaAs, with microwave measurement experience
- Eligibility to access controlled US export technology and obtain security clearance
Preferred:
- Advanced Engineering or Physics Degree
- Experience designing linear Power Amplifiers for SATCOM
- Proficiency with simulation tools and broad knowledge of microwave circuit design
Additional Information
Salary range: $149,893.51 - $219,589 annually in Richardson, TX. Benefits include health coverage, 401K, paid holidays, and more. CAES promotes diversity and equal opportunity employment. For accommodations, contact [email protected].
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