Packaging Engineer - Texas Instruments : Job Details

Job DescriptionChange the world. Love your job.Interface across various work areas and organizations to help with the design, development and analysis of different semiconductor packaging technologies to enable differentiation for TI's analog and embedded processing products. TI's innovative packaging technologies are designed to solve customers' problems by delivering advances in miniaturization, integration, high reliability, high performance, and low power. In this role you'll get the opportunity to thrive in a fast paced, dynamic environment where high-energy, prioritization skills and adaptability are a must!As a member of our Flip Chip packaging team, you'll have the chance to interact with many product groups and functions. You'll have high visibility on your projects, with strong opportunities for growth both within our team and across the Packaging Technology Solutions organization.Responsibilities may include:Develop new requirements for Flip Chip CSP (FCCSP) packaging and bump process development and maintain quality of existing packages for Automotive, Industrial, Aerospace & Defense, Mobile and Enterprise applicationsDefine FCCSP assembly and bump process requirements based on customer requirements and end applicationsDevelop new bump and flip chip packaging technologies and process qualification programsPerform integrity analysis of bump and flip chip packaging technologies utilizing appropriate toolsPerform bump and flip chip package technologies characterizations including cost effectiveness studiesAct as a liaison with OSATs (outsourced assembly test sites), internal assembly sites and material vendors to develop new Flip Chip CSP Packaging technologies and materials for various end applicationsMaintain product quality while developing and introducing new bump and FCCSP technologies and package structures including cost reduction programsCoordinate the introduction of new FCCSP assembly processes, package structures and materials into productionPrepare and/or update specifications and application notes for FCCSP technologiesQualificationsMinimum requirements:Bachelor's degree in Chemical Engineering, Mechanical Engineering, Electrical Engineering or other related Engineering degreeMinimum 10 years of relevant experience in Flip Chip interconnect, Substrate Technology and FCCSP Packaging manufacturing technologyExperience in package design, new material development and electrical/thermal/mechanical modeling to support developmentPreferred qualifications:Experience developing new Flip Chip packaging technology solutions with assembly sites and interfacing with suppliersExperience with FCCSP substrate technologies, design rules and developing substrate materials for advanced packagingExperience in data analysis, automation and AI/ML to enhance package design, reliability and manufacturing processExperience in bump and wafer level packaging technology processesExperience in package design, new material development and electrical/thermal/mechanical modeling to support developmentExperience designing new design of experiments (DOEs) to develop a new process, materials or to support failure analysis Ability to establish strong relationships with key stakeholders critical to success and driving alignment, both internally and externallyStrong verbal and written communication skillsAbility to quickly ramp on new systems and processesDemonstrated strong interpersonal, analytical and problem-solving skillsAbility to work in teams and collaborate effectively with people in different functionsAbility to take the initiative and drive for resultsStrong time management skills that enable on-time project deliveryAbout UsWhy TI? Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics. We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TI Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us. About Texas Instruments Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com. Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment. All qualified applicants will receive consideration for employment without regard to race, color, religion, creed, disability, genetic information, national origin, gender, gender identity and expression, age, sexual orientation, marital status, veteran status, or any other characteristic protected by federal, state, or local laws. If you are interested in this position, please apply to this requisition.About the TeamTI does not make recruiting or hiring decisions based on citizenship, immigration status or national origin. However, if TI determines that information access or export control restrictions based upon applicable laws and regulations would prohibit you from working in this position without first obtaining an export license, TI expressly reserves the right not to seek such a license for you and either offer you a different position that does not require an export license or decline to move forward with your employment.