MTS Silicon Photonics Product Packaging Materials - GLOBALFOUNDRIES : Job Details

This hands-on packaging materials integration role will deliver industry leading electro-optical transceivers using GFs Photonix platform and advanced packaging 2.5 D and 3 D co-packaged optics form factors meeting customer requirements. The candidate will bring a strong focus on packaging and assembly materials used for each step in Si. Ph Flip Chip packaging, including laminate buildup, optical adhesives, interconnect metallurgy, underfills and adhesives, thermal materials, and more. Focus on materials and material selection to insure product and module assembly manufacturability and reliability, performance, reducing package risk factors, meeting packaging design rules, and material selection criteria to meet assembly, electrical, photonic and thermal requirements for chiplet and photonic packages and modules. A successful candidate would possess material characterization expertise for photonic and electronic packages, with primary focus on the compatibility of photonic interconnec...Packaging, Materials, Product, Photo, Design, Assembly