Microelectronics Packaging & Design Engineer - AmTECH Microelectronics : Job Details

Microelectronics Packaging & Design Engineer

AmTECH Microelectronics

Job Location : Morgan Hill,CA, USA

Posted on : 2025-08-10T01:19:38Z

Job Description :

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AmTECH Microelectronics is a semiconductor packaging solutions and services company located in Silicon Valley, Morgan Hill, California. Our services include design for manufacturing, process development, and prototype to volume-level production. We have an immediate opening for a Microelectronics Packaging and Design Engineer.

About the Role

In this position, you will be responsible for developing microelectronics assembly and packaging process flows for the manufacturing floor. This involves knowledge of automated state-of-the-art manufacturing equipment and tools, as well as experience with materials like epoxies and solders. The assembly processes include flip chip bonding, die bonding, wire bonding, vacuum reflow, and encapsulation of semiconductor components. You will define manufacturing processes, ensure best practices, lead technicians and operators, and serve as a communication bridge between the production floor and customers.

Job Responsibilities

  • Review customer documentation, statements of work, workflows, CAD files, and technical data sheets.
  • Provide feedback on design guidelines for packaging and design.
  • Define, improve, and monitor manufacturing processes for microelectronics assemblies.
  • Collaborate with process engineers on programs for equipment such as flip chip and die bonding, wire bonding, microscopy, profilometers, and dispensing equipment.
  • Utilize AutoCAD Inventor for project drawings and designs.
  • Manage tools, fixtures, substrates, and materials including solders, epoxies, alloys, pastes, and wires.
  • Consult with customers through PowerPoint presentations and AutoCAD documents to suggest design improvements for manufacturability.
  • Have experience with process flows for semiconductor packaging.

    • Job Qualifications

    • Bachelor's or Master's Degree in mechanical or materials science preferred.
    • 3+ years of industry experience.
    • Knowledge of design rules for manufacturing and packaging semiconductors, electronics, and photonics.
    • Ability to make recommendations, work in a team, and keep detailed records.
    • U.S. Citizen or Permanent Resident (required for government contracts).

    Other Experience or Abilities

    • Flexibility to work overtime as needed.
    • Ability to lift or carry up to 20+ pounds.
    • Comfort with walking, bending, sitting, standing on ladders, and attention to visual detail.
    • Knowledge of microelectronics manufacturing, ESD & FOD mitigation, ISO9001, and PCB assembly materials.
    • Medical insurance benefits provided.

    Job Type: Full Time

    Schedule: Monday through Friday, 8:00 am to 4:30 pm.

    Seniority level
    • Mid-Senior level
    Employment type
    • Full-time
    Job function
    • Information Technology
    Industries
    • Semiconductor Manufacturing
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