Electronics Packaging Engineer III - Jobs via Dice : Job Details

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Dice is the leading career destination for tech experts at every stage of their careers. Our client, Lockheed Martin Corporation, is seeking qualified candidates for the following position. Apply via Dice today!

Join Our Team as an Electronics Packaging Engineer where you will work on developing sophisticated avionics products in a world-class Integrated Product Development environment.

Location: Highlands Ranch, CO

Space is a critical domain, connecting our technologies, security, and humanity. At Lockheed Martin Space, we harness space to innovate, reduce costs, and push technological boundaries. We aim to create future-ready solutions focusing on resiliency and security, advancing spacecraft, and reimagining space connectivity. Join us in shaping a new era in space and building a career that's built for you.

• Develop electronics packaging including mechanical design, stress, and thermal analysis.
• Manage drawing releases, including CCTC management, PMP processing, and schedule oversight.
• Research, design, develop, and test electro/mechanical systems and components.

• Experience with full product design lifecycle and hardware design coordination.
• Proficiency in CAD modeling (CREO, SolidWorks, or similar).
• Experience in tolerance analysis and hardware integration.
• 5+ years of professional experience with a Bachelor's degree or 3+ years with a Master's degree.

U.S. citizenship is required.

We support our employees with comprehensive benefits, volunteer opportunities, and a focus on innovation and ethics. Join us to experience your future in space technology.

This position supports part-time remote work with a flexible schedule. The salary range varies by location and experience, with benefits including health insurance, 401(k), paid time off, and more.

The application window closes in 90 days. Early applications are encouraged for optimal consideration.