Distinguished Member of Technical Staff, Package Simulation - Micron Technology : Job Details

Overview

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Join Micron in an outstanding role where you will build the future of semiconductor packaging technology. As a Semiconductor Package Simulation & Architecture Engineer, you will be at the forefront of innovation, crafting flawless designs from concept to market. This position is developed for a highly skilled professional with deep expertise in packaging, thermal/mechanical & electrical simulation along with product architecture. You will coordinate technology staging, leading all aspects of electrical, mechanical, and logical requirements. Your role involves ensuring package development aligns with both product and system integration goals through extensive collaboration with multi-functional teams.

Package Simulation

• Proficiency in electrical simulation software (e.g., Ansys HFSS, SIWAVE, Mentor Xpedition, Cadence Sigrity) for analyzing signal and power integrity.
• Skills in using mechanical modeling software (e.g., ANSYS Mechanical, Abaqus, COMSOL) for thermomechanical analysis, warpage prediction, and reliability evaluation.
• Experience with multi-physics simulation and co-development environments; ability to interpret simulation data and drive build iterations.

Package Development

• Strong background in package layout, substrate composition, interposer technology, and advanced packaging platforms (FC-BGA, SiP, 2.5D/3D IC, etc.).
• Knowledge of DFM (Build for Manufacturability) and DFx or equivalent experience (Build for Test, Reliability, Cost).
• Familiarity with CAD tools and package composition software (e.g., Cadence Allegro Package Composer, Mentor Graphics, AutoCAD).

Product Architecture & Engineering

• Skill to develop comprehensive packaging solutions that meet power, performance, area, and reliability (PPAR) objectives.
• Experience integrating package requirements with silicon and board/system-level constraints.
• Understanding of industry standards (JEDEC, IPC, IEEE) and regulatory compliance as it relates to packaging materials and structures.

System Integration

• Demonstrated proficiency in aligning package, board, and system constraints.
• Experience leading technical interface between packaging teams and platform/system architects.

Analytical and Problem-Solving Skills

• Demonstrated success in fixing intricate electrical and mechanical issues within packaging and interconnect structures.
• Ability to perform root cause analysis using empirical and simulation data, and develop solutions for reliability improvement.

Communication and Leadership

• Excellent verbal and written communication skills; ability to convey sophisticated technical concepts to diverse audiences.
• Experience crafting user documentation, developing specifications, and whitepapers.
• Mentorship and leadership experience in cross-disciplinary environments.

Desirable Qualifications

• PhD or Master's degree in Electrical Engineering or Mechanical Engineering.
• 15+ years of relevant experience in semiconductor packaging engineering or related fields.
• Authorship of patents and publications in the field of packaging technology.

Compensation and Benefits

The US base salary range that Micron Technology estimates it could pay for this full-time position is: 221,000.00 - 442,000.00. Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experience, tenure and relevant education or training. The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process. Additional compensation may include benefits, discretionary bonuses and equity.

Benefits and Equal Opportunity

Micron is an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

To learn about your right to work please refer to the applicable notices. To learn more about Micron, please visit micron.com/careers. US Sites Only: For assistance with the application process and/or reasonable accommodations, contact [email protected] or 1-800-###-#### (select option #3).

Micron prohibits the use of child labor and complies with all applicable laws and labor standards. Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for employment.

AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate\'s true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.

Fraud alert: Micron advises job seekers to verify the authenticity of any communication claiming to be from Micron by using the official Micron careers website.

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