3D Heterogeneous Integration Design Enablement Engineer (2025 New College Graduate) - GLOBALFOUNDRIES : Job Details

GlobalFoundries Fab 8 is seeking a motivated R&D design enablement engineer to become part of our state-of-the-art 300 mm fabrication facility in Malta, New York. This role will entail 3 D heterogeneous integration (3 DHI) design enablement to enable our next-generation advanced packaging R&D efforts, which include wafer-to-wafer bonding, die-to-wafer bonding, TSV/ TOV and interposer development. Essential Responsibilities: Publish Design Manual (DM) specifications based on failure modes identified for packaging required by the product lines in partnership with the unit process and R&D engineers. DM is a collection of all technology restrictions (geometry rules, electrical rules, etc.) that must be followed for an integrated circuit (IC) design to be manufacturable. Advanced packaging liaison to the DM and PDK (Process Design Kit) teams to translate packaging requirements to a device enablement specification covering: design rules, library device(TSV) layouts, layout vs schematic(LVS) ...Engineer, Enablement, Integration, Design, Graduate, Packaging, Manufacturing, Business Services