Overview
Join our team to lead the design and development of cutting-edge IC packaging solutions for advanced laser and opto-electronic ASIC chips. This role bridges hardware and manufacturing engineering, driving innovation from concept to production.
Base pay range
$150,000.00/yr - $180,000.00/yr
Location: San Francisco, CA (some travel required)
What You'll Do
- 50% Collaborate with hardware engineers on package design
- 50% Partner with manufacturing engineers to build and implement designs
- Act as the communication bridge between design and build teams
- Direct vendors producing components like substrates, epoxies, coated glass, PCBAs, and tooling
Responsibilities
- Own end-to-end IC package design, simulation, and development
- Collaborate across disciplines to build robust packages for harsh environments
- Transition prototypes to high-volume production
- Define reliability test plans and conduct failure analysis
- Manage sourcing, quoting, and low-volume orders
Required Skills & Experience
- 5+ years in semiconductor packaging or 2+ years with a relevant master's degree
- Proficiency in 3D CAD (SolidWorks) and FEA tools (ANSYS)
- Hands-on experience with die bonding, wirebonding, and optical alignment
- Familiarity with ceramic, CMOS, BGA, and organic substrates
- Wafer-level processing and failure analysis expertise
- Experience with optical systems (LiDAR, cameras, microscopes)
Plusses
- Degree in Materials Science, EE, ME, or related field
- Statistical analysis for volume production
- Automated microelectronic/photonic assembly experience
Details
- Seniority level: Associate
- Employment type: Full-time
- Job function: Manufacturing
- Industries: Manufacturing
We're unlocking community knowledge in a new way. Experts add insights directly into each article, started with the help of AI.
#J-18808-Ljbffr