Teledyne Technologies Incorporated
Job Location : Goleta,CA, USA
Posted on : 2025-08-21T17:36:23Z
Job Description :
As part of the uncooled detector (focal plane array) research and development team, the successful candidate will have responsibility for engineering wafer fab processes including plasma etch, thin film deposition, lithography, and wet cleans for next generation infrared detector designs. Candidate will design and implement new processes and automate or improve existing ones to support aggressive technology development goals. They will also own different tools and associated modules in the area. Candidate will characterize wafers and devices using SEM and or FIB/ SEM. As part of process development, hands-on wafer fabrication and characterization of pilot lots is required. This is the right place for a self-directed, goal-oriented, collaborative engineer. The work is varied and challenging where creative problem-solving opportunities are many. Our culture is collaborative, supportive, and fun. The work environment is mixed general office and clean room/lab. Primary Duties & Responsibil...Process Engineer, Engineer, Processing, Process Control, Manufacturing, Fabrication
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