Job Location : Albany,NY, USA
Introduction
The hired candidates would be a demonstrated technical and industry leader in semiconductor plasma etch with fundamental and deep understanding of plasma physics, etch chemistries, and plasma etch equipment system. The candidate will be a hands-on engineering leader with significant expertise in FEOL/MOL/BEOL patterning processes such as multi patterning etch, conductor/dielectric etch, high aspect ratio etch. The candidate should also demonstrate strong understanding of industry trends and roadmap in the . The position also involves mentoring junior engineers and close collaboration with multi company and cross function engineers from materials, unit process, equipment, integration, layout design, and modeling. Generation of Intellectual Property for IBM and protection of it through the patenting process are also expected. Strong analytical and design-of-experiment experience, and excellent written and verbal communication skills in English are required.
Your role and responsibilities
IBM Research at Albany, NY is seeking experienced engineer who will push boundaries in the development of cutting-edge patterning methodologies and plasma etch processes for next generation semiconductor technologies. In this role, you will be responsible for defining patterning strategies from initial concept of film stacks and process flow through the development of plasma etch processes and its maturing as process of record to meet advanced logic ground rule targets.
Required technical and professional expertise
Bachelor's degree in a science or engineering discipline
5+ years hands-on industry experience in plasma etch process or plasma etch equipment development
5+ hands-on experience in a semiconductor research and development environment
5+ years hands-on experience with interpreting failure analysis from structural and chemical characterization techniques.
Design of experiments, process controls, and statistical data analysis
Preferred technical and professional experience
Master/PhD degree in a science or engineering discipline
10+ years hands-on industry experience in plasma etch process or plasma etch equipment development
10+ years hands-on industry experience in FEOL/MOL/BEOL etch process development
10+ years hands-on industry experience in a semiconductor research and development environment
IBM is committed to creating a diverse environment and is proud to be an equal-opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, gender, gender identity or expression, sexual orientation, national origin, caste, genetics, pregnancy, disability, neurodivergence, age, veteran status, or other characteristics. IBM is also committed to compliance with all fair employment practices regarding citizenship and immigration status.