Advanced Packaging Engineer
: Job Details :

Bold Thinking. World Changing. At SkyWater, our ingenuity helps improve lives around the world by manufacturing U.S.-made semiconductors that are essential ingredients of modern life. Automotive safety enhancements, life-saving medical devices, consumer electronics, and American security require semiconductors. Employees work at our Minnesota headquarters or Florida location to make a difference.

Explore what's possible. Joining our U.S.-based team means contributing to and learning about the commercialization of groundbreaking technologies such as superconducting circuits, 3D integrated chips, carbon nanotubes, photonic devices, micro electro-mechanical systems, and more. We serve aerospace, defense, medical, automotive, consumer, and industrial markets, with customers relying on our IP security and manufacturing quality.

Step into the future. Our values of Integrity, Excellence, Collaboration, Empowerment, and Growth Mindset foster an empowered, learning environment. We invest in developing highly skilled employees, including those entering the workforce, military veterans, and individuals from diverse educational backgrounds.

Are you bold thinking? Join our team and help us change the world!

Job Summary:

We seek a highly skilled Advanced Packaging Engineer with hands-on experience in semiconductor packaging technologies. The successful candidate will develop, optimize, and sustain advanced packaging solutions.

Key Responsibilities:

• Lead process development and optimization for IC packaging processes such as compression mold, ball attach, laser groove, dicing, die attach, die prep, tape & reel, backgrinding/thinning.
• Define and execute DOE for new materials and process evaluations.
• Establish process windows and control limits; develop process documentation including FMEA and control plans.
• Support new product launches and ramp-up by collaborating with manufacturing and product teams.
• Identify root causes and implement corrective actions for yield and reliability issues.
• Troubleshoot process issues, driving continuous improvements.
• Work with vendors and suppliers to develop next-generation technologies.
• Maintain clear documentation of process changes and improvements.
• Present findings and improvement suggestions to leadership.

Required Qualifications:

• 5-10 years of hands-on experience in semiconductor packaging processes.
• Knowledge of JEDEC reliability testing and failure modes.
• Familiarity with FOWLP/FOPLP ball attach and RDL materials is a plus.
• Strong failure analysis and troubleshooting skills, familiar with 8D and Six Sigma.
• Excellent problem-solving, communication, and teamwork skills.
• Ability to work in a fast-paced, cross-functional environment.
• BSc, MSc, or PhD in Materials Science, Chemical, Mechanical, Electrical Engineering, or related field.
• US Citizenship Required: Must hold or be able to obtain a security clearance.

The annual salary range is $110,000 - $165,000, based on experience and credentials. SkyWater offers competitive pay, incentive plans, 401k match, insurance, stock options, and a comprehensive benefits package including medical, dental, vision, mental health, legal planning, disability, paid time off, holidays, and on-site amenities. We are an Equal Opportunity Employer and provide reasonable accommodations for applicants with disabilities.

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