Product Lead - Advanced Semiconductor (3303-1) Santa Clara, CA
ASIC design, semiconductor electronics, mixed-signal, chiplet design, advanced packaging, chiplet integration, high-speed chiplet, signal & power integrity
If you post this job on a job board, please do not use company name or salary.Experience level: Mid-seniorExperience required: 9 YearsEducation level: Bachelor's degreeJob function: Information TechnologyIndustry: Information Technology and ServicesPay rate: View hourly payrateTotal position: 1Relocation assistance: NoVisa sponsorship eligibility: No
JOB DESCRIPTION
Product Lead - Advanced Semiconductor Packaging and Integration
Position Overview:We are seeking a highly experienced candidate with a robust background in Advanced Semiconductor Electronics and ASIC Design. The ideal candidate will possess extensive knowledge in mixed-signal design, chiplet design, and advanced packaging. This role demands a deep understanding of both BEOL and FEOL semiconductor processing, as well as current packaging and substrate technologies for advanced packaging.
Responsibilities:
Lead the product development lifecycle for cutting-edge semiconductor electronics and ASICs.Collaborate with cross-functional teams to innovate and integrate mixed-signal and chiplet designs.Drive advancements in chiplet integration and high-speed chiplet I/O.Ensure signal and power integrity throughout the design and implementation phases.Stay abreast of the latest trends and technologies in advanced packaging and semiconductor processing.Requirements:
Bachelors or Masters degree in Electrical Engineering, Computer Engineering, or a related field.At least 10 years of experience in semiconductor electronics and ASIC design.Proficiency in mixed-signal design and chiplet design.In-depth knowledge of advanced packaging, BEOL and FEOL semiconductor processing.Experience with current packaging technologies and substrate technologies for advanced packaging.Strong expertise in chiplet integration and high-speed chiplet I/O.Proven track record in ensuring signal integrity and power integrity in complex designs.Collaborate with cross-functional teams to ensure seamless integration and timely delivery of projects.Mentor and guide junior engineers, fostering a culture of continuous learning and innovation.Preferred Qualifications:
Ph.D. in a relevant field.Experience with leading industry-standard design and simulation tools.Published works or patents in semiconductor technologies.Excellent leadership, communication, and project management skills.#J-18808-Ljbffr